Prediction of central temperature raise in silica/CB filled SSBR/BR compounds under dynamic compression

摘要

In a previous contribution[1], a temperature raise equation has been developed to predict the central temperature raise of carbon black/polymerized styrene butadiene rubber (CB/SBR) composites during the compression flexometer test. In the present contribution, the influence of silica/CB ratio on heat generation, thermal conductivity and compression fatigue temperature raise of solution polymerized styrene butadiene rubber/butadiene rubber (SSBR/BR) was investigated. The results showed that the loss modulus increased with the addition of the silica/CB ratio. The thermal conductivity decrease with the increase of silica/CB ratio. Besides, the bottom temperature raise (Tw1) and central temperature raise (Tmax) of rubber block reduce while the temperature difference between Tmax and Tw1 (Tmax - Tw1) increases with the increasing silica/CB ratio. Moreover, the central temperature raise of the samples was predicted by the temperature raise equation. As a consequent, The estimated temperature raise Tmax have been compared with the test values T1 and the error bar was less than 10%, indicating the accuracy of the temperature raise equation for the silica/CB/SSBR/BR composite.