Interconnect roles for emerging memory technologies in 3D architecture

摘要

Emerging memory integration into 3D architecture has the potential to overcome current memory shortfalls in speed, power consumption, reliability and cost vectors for the future data centric computing. Intensive investment has been placed in various cell structures (PCRAM, STTRAM, OxRAM and CBRAM) and 3D architectures (3D XPoint, 3D ReRAM) recently to capture the future commercial IoT market. After reviewing status of emerging memories and 3D architectures, that are generally back end of the line (BEOL) compatible, this talk will highlight the challenges of interconnect in these new element and integration, and discuss the need of new materials.