A 14.4Gb/s/pin 230fJ/b/pin/mm multi-level RF-interconnect for global network-on-chip communication

摘要

A simultaneous and reconfigurable multi-level RF-interconnect (MRI) for global network-on-chip (NoC) communication is demonstrated. The proposed MRI interface consists of baseband (BB) and RF band transceivers. The BB transceiver uses multi-level signaling (MLS) to enhance communication bandwidth. The RF-band transceiver utilizes amplitude-shift keying (ASK) modulation to support simultaneous communication on a shared single-ended on-chip global interconnect. A phase-locked loop (PLL) is also designed to support the fully-synchronous NoC architecture. The MLS-based BB and ASK-based RF band carry 10Gb/s/pin and 4.4Gb/s/pin, respectively. The proposed system is fabricated in a 65nm CMOS process and achieves an energy/b/pin/mm of 230fJ/b/pin/mm.