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150mm Silicon carbide selective embedded epitaxial growth technology by CVD

机译:150mm CVD法碳化硅选择性嵌入外延生长技术

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Summary form only given. The complete presentation was not made available for publication as part of the conference proceedings. In this work, we have developed a selective embedded epitaxial growth process on 150-mm-diameter wafer by vertical type hot wall CVD reactor with the aim to realize the all-epitaxial 4H-SiC MOSFETs [1, 2, 3, 4, 5]. We found that at elevated temperature and adding HCl, the epitaxial growth rate at the bottom of trench is greatly enhanced compared to growth on the mesa top. And we obtain high growth rate 7.6μm/h at trench bottom on 150mm-diameter-wafer uniformly with high speed rotation (1000rpm).
机译:仅提供摘要表格。完整的演示文稿未作为会议记录的一部分公开发布。在这项工作中,我们通过垂直型热壁CVD反应器在150毫米直径的晶圆上开发了选择性嵌入式外延生长工艺,旨在实现全外延4H-SiC MOSFET [1,2,3,4,5 ]。我们发现,在高温和添加HCl的情况下,与台面顶部的生长相比,沟槽底部的外延生长速率大大提高。并且在高速旋转(1000rpm)的情况下,在直径为150mm的晶片上的沟槽底部获得了7.6μm/ h的高生长速率。

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