Fabrication and mechanical characterization of flexible devices with sensors with magnetoresistance responses above 150

摘要

This digest reports on the integration for the first time of magnetic tunnel junction (MTJ) sensing devices with magnetoresistance responses above 150% on flexible substrates, as opposed to previous attempts in which figures below 54% have been obtained. These are able to bend and conform to non-planar geometries, non-conformal and hard-to-reach regions of space for magnetic sensors processed in conventional rigid substrates, paving the way for new spintronic applications. Their fabrication process is based on polyimide (PI) materials due to their flexibility, thermal stability, chemical resistance, high mechanical modulus, and biocompatibility. Magnetoresistive performance is characterized in terms of controlled mechanical load conditions.