Packaging and process optimization for three-dimensional structure unit of double-sided cooling IGBT module

摘要

Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and the soldering process has been simulated by finite element software. Meanwhile, reflow curve of soldering the Three-dimensional structure of double-sided cooling IGBT module has been determined, and the soldering process has been optimized. Results show that the void rate in each layer of the structure is less than 3%. The optimized parameters of the progress meet the requirement of packaging the Three-dimensional structure of double-sided cooling IGBT module.