Study on the POP ceramic package multilayer board design

摘要

In this paper, multilayer ceramic board design about the POP ceramic package is studied Stripline design such as signalline, electrical wire, offset is optimized with software such as Cadence and HFSS. Signalline transfers loss is obtained as 0.35dB/2GHz (25mm), electromagnetism isolation larger than 70dB. The complexity circuitry design for transfers loss signal delay electromagnetism isolation is satisfied The result has significance affect on multilayer board design of POP ceramic package.