Grad. Sch. of Natural Sci. Technol., Okayama Univ., Okayama, Japan;
air; copper; fracture; nickel; permanent magnets; printed circuit testing; sodium compounds; solders; tensile strength; tensile testing; Cu; NaCl; NaCl solution; Ni; air; copper-cored lead-free solder ball; copper-cored lead-free solder joints; corrosive conditions; distilled water; electric connections; electric devices; nickel rod joints; permanent magnets; salt water environments; solder joint strength; tensile strength; tensile testing device; tensile tests; Corrosion; Joints; Lead; Nickel; Soldering; Stress; Testing;
机译:采用二极管激光焊接的细间距QFP无铅焊接接头的拉伸强度
机译:通过拉拔试验和导线表面观察评估细铜线和无铅焊点强度
机译:金属间化合物对原位拉伸试验中Sn3.0Ag0.5Cu无铅焊点断裂行为的影响
机译:使用永磁体的试验装置评估空气,蒸馏水和NaCl溶液中铜芯无铅焊点的拉伸强度
机译:通过联合液位测试研究无铅BGA中的散装焊料和金属间故障。
机译:通过抗拉强度变化分析和环境退化下的混凝土抗位移试验评估薄板复合防水接头类型
机译:回流焊接接头剥离强度评价
机译:修复的铅锡/无铅焊点的振动测试(预印)