MacDermid, Waterbury, CT, USA;
copper; design of experiments; electroplated coatings; electroplating; filling; integrated circuit interconnections; mechanical properties; IC substrates; acid copper plating cycles; chemical components; defect-free filled holes; design of experiments; direct current electroplating; electroplated copper filling; fine line resolution; high density interconnect constructions; horizontal conveyorized electroplaters; mechanical properties; periodic pulse reverse electroplating; through-hole copper filling process; vary;
机译:通过镀铜无孔高速填充陶瓷通孔
机译:通过铜电镀实现低纵横比的通孔填充
机译:有机酸对铜电镀通孔填充的影响
机译:不同厚度的基板上通孔的电镀铜填充
机译:通孔电镀建模。
机译:硫酸铜和硫酸对电镀HDI电路板盲孔填充的影响
机译:硫酸铜和硫酸对电镀HDI电路板盲孔填充的影响