New Japan material process for LED flip chip + WL LED

摘要

LED Solid state lighting will become increasingly more important in the future, and high performance is required more. And new material and process is quite important for LED flip chip and wafer level LED packaging. This paper show new Japan material quick views for LED flip chip & wafer level packaging. - New Japan material & process introduction for LED high power flip chip & wafer level LED packaging; Insulation material Encapsulation material, Flip chip connection method, Plating technology.