Fluid structure interaction simulation in IC encapsulation process

摘要

This paper presents three-dimensional (3D) fluid structure interaction (FSI) technique; using Mesh based Parallel Code Coupling Interface (MpCCI), for the visualization of wire sweep during encapsulation. The effects of number of mold cavity outlet vents on the melt flow behavior, wire sweep, and von Mises stress distributions, are mainly studied. 3D model of mold and wire were designed using GAMBIT, simulated fluid flow and structural using FLUENT and ABAQUS. Three types of mold cavity simple model namely Type D1, Type D2 and Type D3 with different outlet vents were studied to analyze wire sweep deformation. Polymer rheology model with curing effect (Castro-Macosko model) have been used in the fluid flow modeling and Volume of Fluid (VOF) technique was applied for melt front tracking for the Epoxy Molding Compound (EMC). In the present study, Type D3 with minimum outlet vent area of mold cavity shows the highest deformation of wire and highest stress distributions. The numerical results of wire deformation pattern were compared with the analytical method and found in good conformity. The strength of MpCCI software in handling FSI problems is proved to be excellent. This present work is expected to be the reference and guideline for microelectronics industry.