Hands-on experience-based microelectronics manufacturing engineering education

摘要

We present a hands-on experience-based microelectronics manufacturing engineering education (MMEE) for a four-year university degree program in the area of microelectronics. Three hands-on experience-based courses are presented, along with a methodology for undergraduate students to acquire hands-on experience through integrated circuits (ICs) design, wafer fabrication and microelectronic packaging. Assessment for hands-on engineering education is considered. As a metric of assessment as learning, students' survey was performed, and we confirmed that our hypothesis on the inclusion of hand-on experience-based courses for MMEE is beneficial to enhance students' motivation of learning.