TDOIN: A Novel Three-Dimensional Optical Interconnection Network for High Performance Computer

摘要

With the rapid development of high performance computers, the interconnection network performance has become a key factor restricting the overall performance. Due to the inherent limitations of the electrical interconnection network, optical interconnection has become a feasible way to improve the performance. In view of BOIN network, we proposed a Three-Dimensional Optical Interconnection Network (TDOIN), and introduced link control protocol and routing algorithms. Furthermore, experimental simulation based on the comparison of TDOIN and BOIN was carried out in case of latency and throughput. The results show that with the increase of network size, TDOIN network has more obvious advantages than BOIN network and can meet the needs of high performance computing systems.