Electronic Packaging Materials Laboratory, School of Materials Science Engineering,Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science Engineering,Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science Engineering,Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science Engineering,Dalian University of Technology, Dalian 116024, China;
机译:表面光洁度对电迁移下倒装芯片焊点失效机理的影响
机译:表面光洁度对电迁移下倒装芯片焊点失效机理的影响
机译:OSP铜表面处理的Sn-Cu焊料合金中的电迁移破坏机理
机译:表面光洁度(OSP和ENEPIG)对Sn-3.0Ag-0.5Cu倒装芯片焊料互连中电迁移引起的失效机理的影响
机译:无铅倒装芯片焊点中电迁移引起的失效的统计和物理分析
机译:基于离散空隙形成的倒装芯片焊点失效的电迁移机理
机译:表面光洁度对电迁移下倒装片焊点失效机理的影响