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Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration

机译：表面光洁度对电迁移下倒装片焊点失效机理的影响

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1. Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration [J] . Y.L.LIN, Y.S.LAI, CM.TSAI Journal of Electronic Materials . 2006,第12期

机译：表面光洁度对电迁移下倒装芯片焊点失效机理的影响
2. Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration [J] . Y. L. Lin, Y. S. Lai, C. M. Tsai, Journal of Electronic Materials . 2006,第12期

机译：表面光洁度对电迁移下倒装芯片焊点失效机理的影响
3. Electromigration-lnduced UBM Consumption and the Resulting Failure Mechanisms in Flip-Chip Solder Joints [J] . Y.L.LIN, C.W.CHANG, C.M.TSAI, Journal of Electronic Materials . 2006,第5期

机译：倒装芯片焊点中电迁移引起的UBM消耗及其导致的失效机理
4. Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect [C] . Huang Mingliang, Chen Leida, Zhou Shaoming, 2011 International Symposium on Advanced Packaging Materials . 2011

机译：表面光洁度（OSP和ENEPIG）对Sn-3.0Ag-0.5Cu倒装芯片焊料互连中电迁移引起的失效机理的影响
5. Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Lead-free Solder Joints [D] . Han, Jung Kyu 2011

机译：热电迁移对倒装芯片无铅焊点中铜溶解和金属间化合物形成的影响
6. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation [O] . Yuan-Wei Chang, Yin Cheng, Lukas Helfen, -1

机译：基于离散空隙形成的倒装芯片焊点失效的电迁移机理
7. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation [O] . Yuan-Wei Chang, Yin Cheng, Lukas Helfen, 2017

机译：基于离散空隙形成的倒装芯片焊点失效的电迁移机制

Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration

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