首页> 外文会议>2011 IEEE International Electron Devices Meeting >Spatial variation of TSV capacitance and method of stabilization with Al2O3-induced negative fixed charge at the silicon-liner interface
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Spatial variation of TSV capacitance and method of stabilization with Al2O3-induced negative fixed charge at the silicon-liner interface

机译:TSV电容的空间变化及Al- 2 O 3 引起的硅衬界面处负固定电荷的稳定化方法

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摘要

Stable TSV capacitance is desired to control spatial TSV performance variation due to non-uniform hot-spot heating. Thin Al2O3 is inserted between PETEOS liner and Si substrate to induce negative fixed charge (Qf = −7.44×1011cm−2). This causes flat-band voltage shift (ΔVFB = +7.37V) and the TSV is operated in the stable accumulation region within the operating voltage of interest (0–5 V). The leakage current density of this combination is reduced by 10X with annealing in forming gas at 300°C.
机译:需要稳定的TSV电容来控制由于不均匀的热点加热而引起的空间TSV性能变化。将薄的Al 2 O 3 插入PETEOS衬里和Si衬底之间以产生负固定电荷(Q f = −7.44×10 11 cm −2 )。这会导致平带电压偏移(ΔV FB = + 7.37V),TSV在目标工作电压(0-5 V)内的稳定累积区域内工作。通过在300°C下形成气体进行退火,该组合的泄漏电流密度降低了10倍。

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