Novel on-chip Through-Silicon-Via Wilkinson power divider

摘要

On-chip Wilkinson power dividers are used in MMW circuit designs such as phased array antenna systems. This paper presents a novel on-chip MMW Through-Silicon-Via (TSV) Wilkinson power divider. HFSS simulations of the TSV Wilkinson power divider in a 130 nm BiCMOS technology revealed insertion loss per λ/4 “arm” of 0.9 dB at 60 GHz with both return loss and isolation better than 18 dB at 60 GHz and good matching in both signal phase and amplitude at the two outputs.