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Method, structure, and design structure for a through-silicon-via Wilkinson power divider
Method, structure, and design structure for a through-silicon-via Wilkinson power divider
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机译:硅通孔威尔金森功率分配器的方法,结构和设计结构
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摘要
A method, structure, and design structure for a through-silicon-via Wilkinson power divider. A method includes: forming an input on a first side of a substrate; forming a first leg comprising a first through-silicon-via formed in the substrate, wherein the first leg electrically connects the input and a first output; forming a second leg comprising a second through-silicon-via formed in the substrate, wherein the second leg electrically connects the input and a second output, and forming a resistor electrically connected between the first output and the second output.
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