Modeling of noise coupling inside multilayer printed circuit boards using cavity model and segmentation technique

摘要

The power distribution network in a printed circuit board (PCB) is an effective path for high-speed digital noise. The noise can be coupled by overlapping power/ground areas or by vias passing through them. This paper details a modeling approach and applies it to a multilayer PCB with six power/ground planes. The multilayer power/ground plane structure is modeled using the cavity model combined with segmentation method, and the vias are modeled using a via-plate capacitance model. This model requires considerably less time, and the results closely match those of full-wave simulations.