Steady-state thermal simulation of ICs based on SKILL language and finite element method

摘要

In this paper, a new method which combines SKILL language with finite element method is presented. The analysis of steady-state thermal simulation of analog circuit designed by Cadence design software is made by this method. Electronic parameters and equivalent thermal resistances of devices can be obtained by Cadence circuit simulation software and finite element analysis software-ANSYS. Then the temperature rise of the device in circuit can be calculated. Combining location message obtained by SKILL program with the temperature rise of device, temperature distribution graph is found. Finally the result is verified by a complete ANSYS analysis.