首页> 外文会议>2010 11th International Conference on Thermal, Mechanical amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) >Large deformation of beam columns - a closed form solution and design guide for vertical buckling probe needles
【24h】

Large deformation of beam columns - a closed form solution and design guide for vertical buckling probe needles

机译:梁柱的大变形-封闭式解决方案和垂直屈曲探针的设计指南

获取原文
获取原文并翻译 | 示例

摘要

Higher pin count and reduced pitch along with increased wafer size set new demands to fine pitch wafer probe technology. Vertical buckling probe needles are one of the available concepts. The required elasticity for contacting the pad is achieved by buckling of the needles. The buckling mode guarantees a consistent contact pressure over a large range of overtravel and thus allows for an optimal tolerance even under changing planarity conditions of the wafer. However, the dimensioning of a buckling needle for specified contact forces seems impossible for designers. Therefore, the authors present closed form solutions for large deformation of buckling beam columns. It is an extension of the Euler buckling cases known from textbooks and goes back to a publication of Thimoshenko regarding the first Euler case. This solution will now be discussed and extended to the fourth Euler case. Its applications will be demonstrated for a vertical buckling probe needle with one end built in and the other end guided by a guide plate. A closed form solution of the force-deflection characteristic will be presented and compared with geometrical nonlinear finite element analysis.
机译:更高的引脚数和减小的间距以及增加的晶片尺寸对细间距晶片探针技术提出了新的要求。垂直屈曲探针是可用的概念之一。接触垫所需的弹性是通过针的屈曲来实现的。屈曲模式可确保在大行程范围内保持一致的接触压力,因此即使在晶片的平面度条件不断变化的情况下,也可以实现最佳公差。但是,对于设计者来说,对于特定的接触力而言,确定屈曲针的尺寸似乎是不可能的。因此,作者提出了屈曲梁柱大变形的封闭形式解决方案。它是教科书中已知的Euler屈曲案例的扩展,可追溯到Thimoshenko关于第一个Euler案例的出版物。现在将讨论该解决方案并将其扩展到第四欧拉情况。将演示其在垂直屈曲探针中的应用,该探针的一端内置,另一端由导向板引导。将给出力-挠度特性的封闭形式解,并将其与几何非线性有限元分析进行比较。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号