首页> 外文会议>2006 Proceedings Twenty Third International VLSI Multilevel Interconnection Conference(VMIC) >A Slow Wave Photonic Crystal Enhancement of Drude-Effect Light Modulators for Intra-Chip Optical Interconnections using 3D Wafer Bonding Techniques
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A Slow Wave Photonic Crystal Enhancement of Drude-Effect Light Modulators for Intra-Chip Optical Interconnections using 3D Wafer Bonding Techniques

机译:用于3D晶圆键合技术的片内光学互连的Drude效应光调制器的慢波光子晶体增强

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It is now widely acknowledged that interconnections are having an increasingly adverse impact on the speed of computers through wiring delay. Electronic interconnections suffer from resistance, capacitance and inductance. Additionally special considerations apply when frequencies exceed 5-10 GHz due to skin effects, silicon substrate losses, and dielectric losses. Additional problems occur due to transmission line effects at millimeter wave frequencies. Optical interconnections are often considered as an alternative for metallic interconnections for these reasons. Although optical interconnections are limited to width and thickness dimensions larger than a wavelength, they can avoid many of the aforementioned metallic parasitics. Recently INTEL demonstrated that it is possible to modulate light in Silicon with a Mach-Zehnder interferometer employing a voltage controlled delay element consisting of a MOS Capacitor. The technique is unusual in that it employs only pre-quantum mechanics concepts of electromagnetic wave interaction with charge carriers in metals (extended to semiconductors). The voltage-controlled delay is derived from the Drude Effect as the light passes through the carrier plasma under the gate electrode induced during accumulation or depletion. Modulation up to 10 Gb/s has now been attained. However, the W dimension of the "gate" electrode of the MOS Capacitor was reported as 2.4mm, which is too long for practical use in driving intra-chip wiring and demands large drivers for the electrode charging. Additionally the L dimension of the "gate" must be wide enough to accommodate the optical wavelength and this therefore limits the speed with which carriers can perfuse into the region under the gate from Source and Drain. To enhance the efficiency of such a device one can redirect the light repeatedly back and forth through the plasma, effectively reusing these carriers. Workers have employed optical resonators to accomplish this. But the optical cavity has a long "ring down" time, limiting the bandwidth of such a device. In this paper we consider the introduction of an augmenting structure called a "photonic crystal" in modern parlance. However, in one important aspect, the concept of photonic crystal is well known to microwave engineers as a slow wave structure. By slowing the optical wave's propagation through the plasma the interaction may be greatly enhanced, while the lengthy ring down time of the resonator can be avoided.
机译:现在,人们普遍认为,互连因布线延迟而对计算机速度产生越来越大的不利影响。电子互连具有电阻,电容和电感。此外,当由于集肤效应,硅衬底损耗和介电损耗而导致频率超过5-10 GHz时,还应考虑特殊的注意事项。由于在毫米波频率下的传输线效应,还会出现其他问题。由于这些原因,通常将光互连视为金属互连的替代方案。尽管光学互连限于大于波长的宽度和厚度尺寸,但是它们可以避免许多上述金属寄生物。最近,INTEL证明,可以使用Mach-Zehnder干涉仪在硅中调制光,该干涉仪采用由MOS电容器组成的压控延迟元件。该技术是不寻常的,因为它仅采用电磁波与金属(扩展到半导体)中的电荷载流子相互作用的量子力学前概念。当光通过在累积或耗尽期间感应的栅电极下方的载流子等离子体时,可从德鲁德效应得出压控延迟。现在已经达到了高达10 Gb / s的调制速度。然而,据报道,MOS电容器的“栅”电极的W尺寸为2.4mm,对于驱动芯片内布线的实际使用来说太长了,并且需要用于电极充电的大型驱动器。另外,“栅极”的L尺寸必须足够宽以容纳光波长,因此这限制了载流子可以从源极和漏极渗入栅极下方区域的速度。为了提高这种设备的效率,可以使光反复重复地通过等离子体来回重定向,从而有效地重用了这些载流子。工人们已采用光学谐振器来完成此任务。但是光腔具有长的“振铃”时间,从而限制了这种设备的带宽。在本文中,我们考虑采用现代术语称为“光子晶体”的增强结构。但是,在一个重要方面,微波工程师将光子晶体的概念称为慢波结构。通过减慢光波通过等离子体的传播,可以大大增强相互作用,同时可以避免谐振器的长时间振铃时间。

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