MECHANICAL PROPERTIES OF POLYMER DIELECTRIC FILMS AT ELEVATED TEMPERATURES

摘要

The miniaturization of microelectronics has led to the use of polymer dielectric films with a thickness less than a micrometer. The use of polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary. The through-plane elastic modulus and change in permittivity for a 1 μm thick Cyclotene™ 4022 film sandwiched by two aluminium electrodes on a silicon wafer are reported. Two circular parallel plate capacitors and four interdigitated electrodes where tested at a pressure of 0, 5, 7.5 and 10 MPa. An initial relative dielectric constant of the film of 2.66±0.05 was obtained. This yields a change in constant equal to 1.241 · 10~(-4)±2.1·10~(-5) per MPa pressure at room temperature. The through-plane modulus showed a linear elastic behaviour equal to 4.73±0.46, 4.11±0.39, 3.64±0.31 and 3.56±0.32 GPa for 20°, 50°, 70° and 100℃ respectively. The modulus at room temperature is in good agreement with the values found in literature.