首页> 外文会议>2003 International Conference on Characterization and Metrology for ULSI Technology; Mar 24-28, 2003; Austin, Texas >Controlling Wafer Contamination Using Automated On-Line Metrology during Wet Chemical Cleaning
【24h】

Controlling Wafer Contamination Using Automated On-Line Metrology during Wet Chemical Cleaning

机译:湿法化学清洗过程中使用自动在线计量控制晶片污染

获取原文
获取原文并翻译 | 示例

摘要

The capabilities of a trace contamination analyzer are discussed and demonstrated. This analytical tool utilizes an electrospray, time-of-flight mass spectrometer (ES-TOF-MS) for fully automated on-line monitoring of wafer cleaning solutions. The analyzer provides rich information on metallic, anionic, cationic, elemental, and organic species through its ability to provide harsh (elemental) and soft (molecular) ionization under both positive and negative modes. It is designed to meet semiconductor process control and yield management needs for the ever increasing complex new chemistries present in wafer fabrication.
机译:讨论并演示了痕量污染分析仪的功能。该分析工具利用电喷雾飞行时间质谱仪(ES-TOF-MS)对晶圆清洗溶液进行全自动在线监测。该分析仪通过在正负两种模式下提供苛刻(元素)和软(分子)电离的能力,可提供有关金属,阴离子,阳离子,元素和有机物质的丰富信息。它旨在满足晶圆制造中不断增长的复杂新化学工艺对半导体工艺控制和成品率管理的需求。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号