SELECTION AND EVALUATION OF HEAT-RESISTANT ALLOYS FOR PLANAR SOFC INTERCONNECT APPLICATIONS

摘要

Over the past several years, the steady reduction in SOFC operating temperatures to the intermediate range of 700～850℃ has made it feasible for lanthanum chromite to be supplanted by metals or alloys as the interconnect materials. Compared to doped lanthanum chromite, metals or alloys offer significantly lower raw material and fabrication costs. However, to be durable and reliable, a metal or alloy has to satisfy several functional requirements specific to the interconnect under SOFC operating conditions. Specifically, the interconnect metal or alloy should possess the following properties: (ⅰ) Good surface stability (resistance to oxidation, hot corrosion, and carburization) in both cathodic (air) and anodic (fuel) atmospheres; (ⅱ) Thermal expansion matching to the ceramic PEN (positive cathode-electrolyte-negative anode) and seal materials (as least for a rigid seal design); (ⅲ) High electrical conductivity through both the bulk material and in-situ formed oxide scales; (ⅳ) Bulk and interfacial thermal mechanical reliability and durability at the operating temperature; (ⅴ) Compatibility with other materials in contact with interconnects such as seals and electrical contact materials.