首页> 外文会议>2002 ASME International Mechanical Engineering Congress and Exposition , Nov 17-22, 2002, New Orleans, Louisiana >ANALYSIS OF GAS CONVECTION AND TEMPERATURE DISTRIBUTION IN A ROTATING WAFER IN A CYLINDRICAL LAMP HEATING APPARATUS
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ANALYSIS OF GAS CONVECTION AND TEMPERATURE DISTRIBUTION IN A ROTATING WAFER IN A CYLINDRICAL LAMP HEATING APPARATUS

机译:圆柱形灯加热装置中旋转晶片的气体对流和温度分布分析

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摘要

A three-dimensional radiation-heat-transfer analysis and a convection-heat-transfer analysis are combined in order to determine the temperature distribution in a rotating wafer in a cylindrical lamp heating apparatus for rapid thermal processing. The calculated results show that the temperature variation in the wafer increases 1.4 K by the effect of natural convection, when inlet gas velocity is 0.1 m/s during 1273 K steady-state heating of the non-rotating wafer. The effect of gas convection on the temperature variations in the wafer can be minimized when the wafer is rotating in an axisymmetric apparatus and the heating rates of the lamps are optimally controlled.
机译:为了确定用于快速热处理的圆柱形灯加热设备中旋转晶片中的温度分布,将三维辐射传热分析和对流传热分析结合在一起。计算结果表明,在非旋转晶片的1273 K稳态加热期间,进气速度为0.1 m / s时,由于自然对流的影响,晶片中的温度变化增加了1.4K。当晶片在轴对称设备中旋转并且对灯的加热速率进行最佳控制时,气体对流对晶片中温度变化的影响可以最小化。

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