Study on Heat Resistance Anaerobic Adhesive Which Expands When Post Cured

摘要

In this paper, N,N-m-phenyenedimaleimide(m-PDM), Polyamide Resin(PI) and Metallic dimethacrylate etc. influencing the heat resistance of anaerobic adhesive has been studied, an anaerobic adhesive composition capable of post-cure expansion and 230℃ temperature resistance comprising a multifunctional methacrylate and m-PDM capable of effectuating expansion upon post-cure has been developed. A homogeneous mixture of a monomer and m-PDM are subjected to a first cure heat stage (Room Temperature) wherein a rigid partially-cured plastic is formed and a post-cure heat stage(150℃) to effectuate permanent expansion of cured adhesive composition.