DYNAMIC CHARACTERIZATION OF SHAPE MEMORY ALLOYS FOR INTEGRATION WITH ELECTRONIC PACKAGING

摘要

Integration of Shape Memory Alloys (SMAs) with electronic packaging depends on detailed knowledge of thermomechanical behavior of SMAs. In this paper, thermomechanical behavior of SMAs is studied using a new approach based on Analytical, Computational, and Experimental Solutions (ACES) methodology. More specifically, variation in modulus of elasticity of equiatomic NiTi alloy is studied, as a function of temperature. The results show that the modulus of elasticity of the NiTi alloy studied herein varies from 38 GPa to 72 GPa as the temperature changes from -15℃ to 190℃, corresponding to phase transition from martensite to austenite. Comparison of analytical, computational, and experimental results shows good correlation.