首页> 外国专利> Thermal control apparatus using shape memory alloy, power electronic system having the same, and shape memory alloy structure thereof

Thermal control apparatus using shape memory alloy, power electronic system having the same, and shape memory alloy structure thereof

机译:使用形状记忆合金,具有相同的电力电子系统的热控制装置及其形状记忆合金结构

摘要

The present invention relates to a heat control device using a shape memory alloy, a power electronic system having the same, and a shape memory alloy structure thereof. A heat control device according to an embodiment of the present invention includes a heat sink disposed on one side of a heat generating electronic device module; an elastic body providing an elastic force in a direction opposite to the direction in which the heat sink is disposed with respect to the heat generating electronic device module; and a shape memory alloy, and becomes a first shape that separates direct or indirect contact of the heat generating electronic device module to the heat sink by the elastic force of the elastic body in the first state, and heats according to the shape memory action in the second state It characterized in that it includes a shape memory alloy structure having a second shape for directly or indirectly contacting the heat generating electronic device module to the sink.
机译:热控制装置技术领域本发明涉及一种使用形状记忆合金的热控制装置,其具有相同的电力电子系统,以及其形状记忆合金结构。根据本发明的实施例的热控制装置包括设置在发热电子设备模块的一侧上的散热器;弹性体在与散热器相对于发热电子设备模块设置的方向相反的方向上提供弹力;和形状记忆合金,并且成为第一形状的第一形状,其通过在第一状态下通过弹性体的弹力分离到散热器到散热器,并根据形状存储器动作加热其特征在于,其包括具有第二形状的形状记忆合金结构,其用于直接或间接地将发热电子设备模块直接与地面接触。

著录项

  • 公开/公告号KR20210073824A

    专利类型

  • 公开/公告日2021-06-21

    原文格式PDF

  • 申请/专利权人 엘에스일렉트릭(주);

    申请/专利号KR1020190164504

  • 发明设计人 황수용;문기영;

    申请日2019-12-11

  • 分类号H01L23/367;H01L23/373;

  • 国家 KR

  • 入库时间 2022-08-24 19:49:48

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