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On the Static Performance of Commercial GaN-on-Si Devices at Elevated Temperatures

机译:高温下商用GaN-on-Si器件的静态性能研究

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摘要

This work provides an experimentally driven comparison between commercialized Gallium Nitride on Silicon (GaN-on-Si) and Silicon (Si) Super Junction (S-J) power devices at elevated temperatures. Elevated temperature experiments were performed to analyze the static performance of the Panasonic PGA26C09DV Enhancement (E-mode) p-GaN layer Gate Injected Transistor (GIT), the Transphorm TPH3206LD, TPH3206PD cascode GaN High Electron Mobility Transistors (HEMTs) and the Infineon SPA15N60C3 Silicon S-J. The Device Under Tests (DUTs) were characterized in a thermal chamber using the B1505A Power Device Analyzer. The elevated temperature measurements were taken; analyzed and compared. The performance of the GaN-on-Si indicated a strong robustness in thermally challenging environments and demonstrated superior performances at higher temperatures in comparison to traditional Si S-J technology.
机译:这项工作提供了在高温下商业化硅上氮化镓(GaN-on-Si)和硅(Si)超级结(S-J)功率器件之间的实验驱动比较。进行了高温实验,以分析Panasonic PGA26C09DV增强型(E模式)p-GaN层栅极注入晶体管(GIT),Transphorm TPH3206LD,TPH3206PD共源共栅GaN高电子迁移率晶体管(HEMT)和Infineon SPA15N60C3硅的静态性能SJ。使用B1505A功率设备分析仪在热室中对被测设备(DUT)进行了表征。进行了高温测量。分析和比较。与传统的Si S-J技术相比,GaN-on-Si的性能表明在热挑战性环境中具有强大的鲁棒性,并且在更高的温度下表现出优异的性能。

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