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Invited TCAD/DA Methodology for MPU and ASIC with Updated Processes and Devices

机译:受邀具有更新的过程和设备的MPU和ASIC的TCAD / DA方法论

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TCAD and DA are the two key computational design tools in VLSI development. Historically, TCAD was used in process and device performance analysis, however, new application for conncurrent process and chip development has been hilighted todate. In this paper, we propose a TCAD/DA methodology for MPU and ASIC design. It allows a predictive chip-design with quick quantitative correlation studies between process-recipe and CKT & delay required in chip performance diagnosis. Effects of statistical process variation on 0.35um CMOS have been rigorously characterized with a new global TCAD calibration technique. Based on the data, process variation effects on a 0.25um CMOS have been predicted, which is concluded that the Vth and ldsat total-variation of the 0.25um CMOS shows less than10
机译:TCAD和DA是VLSI开发中的两个关键计算设计工具。从历史上看,TCAD用于过程和设备性能分析,但是,迄今为止,用于并行过程和芯片开发的新应用程序已经亮相。在本文中,我们提出了一种用于MPU和ASIC设计的TCAD / DA方法。它允许进行预测性芯片设计,并在芯片性能诊断所需的工艺配方与CKT和延迟之间进行快速的定量相关研究。统计过程变化对0.35um CMOS的影响已通过新的全局TCAD校准技术进行了严格表征。根据这些数据,可以预测工艺变化对0.25um CMOS的影响,结论是0.25um CMOS的Vth和ldsat总变化显示小于10

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