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High Temperature Microwave Modelling and Circuit Design with MESFET's and HBT's

机译:MESFET和HBT的高温微波建模和电路设计

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摘要

Novel microwave circuit structures have been designed and fabricated for application at high operating temperatures. The required simulation and characterization of MESFET and HBT devices at high ambient temperatures have been carried out. Novel physical analytical models for the high temperature performance of MESFET's and HBT's were developed. As an example a fully integrated radar front-end operating at temperatures up to 200℃ is given in the paper.
机译:已经设计和制造出新颖的微波电路结构,以用于高工作温度下。在高环境温度下,已经进行了所需的MESFET和HBT器件仿真和表征。开发了用于MESFET和HBT高温性能的新型物理分析模型。作为示例,本文给出了在200℃以下的温度下运行的完全集成的雷达前端。

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  • 会议地点 San Francisco CA(US);San Francisco CA(US)
  • 作者单位

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

    Institut fuer Hochfrequenztechnik Technische Hochschule Darmstadt Merckstr. 25 D-64283 Darmstadt, Germany;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 通信理论 ;
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