DC-45 GHz Interconnections With New Flexguide Technology

摘要

At frequencies above a few GHz, conventional interconnection techniques such as wire bonding and tape automated bonding (TAB) no longer meet the requirements for low loss transmission. We present a novel method for high-frequency interconnection of semiconductor devices using flexible waveguides - 'flexguides'. A special technique enables direct bonding of the flexguides without the use of flying leads. Simulations and measurements show excellent performance with an insertion loss of less than 0.8 dB in the frequency range from DC to 45 GHz.