Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition

机译：具有可变电阻边界条件的热收缩/扩展电阻的闭式方程

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摘要

Simple equations are developed for predicting thermal constriction/spreading resistances associated with heat transfer in electronics packaging applications.

机译：开发了简单的方程式来预测与电子封装应用中的热传递相关的热收缩/扩散阻力。

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来源
《1994 international electronics packaging conference》|1994年|111-121|共11页
会议地点 Atlanta GA(US)
作者
Seaho Song; Seri Lee; Van Au;
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作者单位

Bell-Northern Research Ltd, Ottawa, Ontario, Canada;

Aavid Engineering, Inc., Laconia, NH;

Bell-Northern Research Ltd, Ottawa, Ontario, Canada;

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会议组织
原文格式 PDF
正文语种 eng
中图分类电真空器件制造工艺;
关键词
constriction resistance; spreading resistance;

机译：抗收缩性扩展阻力;

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Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition

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