Analysis of radiation coupling from via in multilayer printed circuit board traces

摘要

This paper considers a multi-layer PCB containing three traces on the top, one middle trace at the centre and a ground plane on the bottom. The centre trace on the top connects with the middle trace through a cylindrical via. The traces are terminated by 50 ohm loads. The centre trace is excited by rf current. A via is used to connect signal path from the top centre trace to immediate bottom middle trace. The paper described analytically the coupling of signal from the centre trace to the adjacent side traces due to radiated signal from the via. The problem also modeled and simulated using HFSS software tool to find the cross talks.