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Design and preparation of polymer components for microspectrometer on the chip

机译:芯片上光谱仪聚合物成分的设计与制备

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In this paper, we present design and preparation of polymer components for microspectrometer fabrication on a chip. The graphical program was used to design novel components in 3D arrangement. In experimental we used two-photon polymerization for direct writing of designed structures in IP-Dip photoresist material. Shape and morphological properties of prepared devices were investigated by scanning electron microscope (SEM). Finally, optical properties were examined by diffraction measurement with red laser.
机译:在本文中,我们介绍了用于芯片上的显微光谱仪制造的聚合物组件的设计和制备。该图形程序用于设计3D排列的新颖组件。在实验中,我们使用双光子聚合来直接写入IP-Dip光刻胶材料中的设计结构。通过扫描电子显微镜(SEM)研究了所制备装置的形状和形态学性质。最后,通过使用红色激光的衍射测量来检查光学性质。

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