3D PACKAGING OF IMAGING AND MIXED FUNCTION ICs FOR NEXT GENERATION ELECTRONICS

摘要

The paper developed for the 2007 Pan Pacific Microelectronics Conference will focus on a 3D System-in- Package solution that includes a high resolution precision camera. The actual imaging system (camera) utilizes an innovative wafer level glass-silicon-glass sandwich structure to enable image-sensing capabilities through the packaging structure. The end result is a true chip-size package with X/Y dimensions identical to the original die size, and a total package thickness that is same as the original silicon thickness, ideal for 3D package stacking processes. Applications for miniaturization include; camera phones, light sensing, bar code readers, fax machines and digital scanners, photodiodes and medical devices.