“WARM” MANUFACTURING

摘要

Even before the solder reflow temperature rose to accommodate lead-free processing we had an increasing number of widely used modules that were becoming increasingly sensitive to process temperatures in optoelectronics including communications lasers and CCD sensors. As we start to see the introduction of nanostructured and more sensitive components, some with biological components that still have to interface with electronic detection systems, we have to plan our manufacturing to cope with room temperature or “warm” assembly. This paper reviews the concerns surfaced during the iNEMI roadmapping and gap analysis program and outlines some assembly options and opportunities. This paper gives timelines and examples of materials systems and updates a previously-presented paper (SMTAI 2006)[1] to describe some of the implementation issues in using nanomaterials and nanostructures in interconnecting electronic devices.