FPGA Multi-Layer PCB Signal Integrity Simulation, Analysis, and Design Considerations

摘要

Field programmable gate array (FPGA) usage is expanding into more high-speed applications, and therefore signal integrity (SI) becomes an increasingly important factor to consider for an FPGA board design. SI issues must be taken into account as part of FPGA input/output (I/O) planning and assignments, as well as in the design and layout of the printed circuit board (PCB) that must support the FPGA. Early design simulation is very important for preventing signal degradation issues that might require a board redesign. This paper presents the pre-layout and post-route SI simulation and analysis of a FPGA multi-layer PCB involving Hyperlynx simulation software. The paper also presents the design considerations for PCB layout and designs implemented in the board-level flow to ensure good SI on the high-speed interfaces.