METAL-FILLED MICROSTRUCTURE AND METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE

摘要

The present invention addresses the problem of providing a metal-filled microstructure and a method for manufacturing a metal-filled microstructure in which it is possible to reduce cost. This metal-filled microstructure has an insulating substrate, a plurality of penetrating paths penetrating in the thickness direction of the insulating substrate, and a plurality of conduction paths penetrating in the thickness direction of the insulating substrate. The insulating substrate is a valve-metal anodic oxide film. The plurality of conduction paths are configured from an electroconductive substance filling the interior of some of the plurality of penetrating paths. The number of conduction paths is less than 70% of the number of penetrating paths across all view fields for 20 discretionary view fields when 12 μm2 is deemed to be one view field.