LED LED LED Layout structure between substrate micro LED array and micro vacuum module for micro LED array transfer using micro vacuum module and Method for manufacturing micro LED display using the same

摘要

In the method of transferring a micro LED array using a micro-vacuum module according to the present invention, the micro-vacuum module is formed to communicate with a plurality of adsorption holes and the plurality of adsorption holes in direct contact with the micro LED to be transferred. Contacting the suction holes of the micro vacuum module on a mother substrate or a temporary substrate including a single or a plurality of vacuum passages and having a micro LED array in the form of a chip; forming a suction force by making a vacuum flow path communicating with the suction holes in contact with the micro LED array in a vacuum state, and peeling the micro LED array from the mother substrate or the temporary substrate using the vacuum; releasing the exfoliated micro LED array after aligning it on a target substrate on which a conductive transfer member is applied; Conducting all of the micro LED arrays having the same color or different colors by performing the peeling, aligning and releasing processes of the micro LED array on the same color or different color micro LED arrays formed on a different mother substrate or temporary substrate than before transferring the transfer member to a desired position on the target substrate coated thereon; and transforming the transfer member through an external force applying medium to physically contact the target substrate and the micro LED array aligned on the target substrate to electrically interconnect them.