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Quality evaluation method for crystal defects of single crystal silicon block, quality evaluation program for single crystal silicon block, manufacturing method for single crystal silicon block and manufacturing method for silicon wafer

机译:单晶硅块晶体缺陷质量评价方法、单晶硅块质量评价程序、单晶硅块制造方法、硅片制造方法

摘要

PROBLEM TO BE SOLVED: To evaluate a quality of a single crystal silicon block, a quality evaluation program of a single crystal silicon block, a method of manufacturing a single crystal silicon block, which can evaluate the quality of crystal defects of the single crystal silicon block with higher accuracy than before. We propose a method for manufacturing silicon wafers. SOLUTION: This is a method for evaluating the quality of a single crystal silicon block obtained by cutting a single crystal silicon ingot grown by the Czochralski method, and has a record of crystal pulling speed at the time of growing a single crystal silicon ingot. It corresponds to the first step of acquiring the value, the second step of measuring the oxygen concentration of the single crystal silicon block along the crystal pulling direction, and the position where the oxygen concentration was measured based on the measured oxygen concentration. It is characterized by including a third step of correcting the crystal pulling speed and a fourth step of evaluating the quality of the crystal defect of the single crystal silicon block based on the corrected crystal pulling speed. [Selection diagram] Fig. 2
机译:需要解决的问题:为了评估单晶硅块的质量,一种单晶硅块的质量评估程序,一种制造单晶硅块的方法,该方法能够以比以前更高的精度评估单晶硅块的晶体缺陷的质量。我们提出了一种制造硅片的方法。解决方案:这是一种评估通过切割直拉法生长的单晶硅锭获得的单晶硅块质量的方法,并记录了生长单晶硅锭时的晶体拉伸速度。它对应于获取值的第一步、沿晶体拉伸方向测量单晶硅块的氧浓度的第二步,以及基于测量的氧浓度测量氧浓度的位置。其特征在于包括校正拉晶速度的第三步和基于校正拉晶速度评估单晶硅块的晶体缺陷质量的第四步。[选择图]图2

著录项

  • 公开/公告号JP2022057967A

    专利类型

  • 公开/公告日2022-04-11

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20200166501

  • 发明设计人 最勝寺 俊昭;金 大基;園部 太暉;

    申请日2020-09-30

  • 分类号C30B29/06;C30B15/20;

  • 国家 JP

  • 入库时间 2022-08-25 00:30:13

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