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IONIC RESIN ENCAPSULATION ADHESIVE FILM AND PREPARATION METHOD, LAMINATED STRUCTURE, AND PHOTOVOLTAIC MODULE

机译:离子树脂封装胶膜及其制备方法,层压结构,光伏组件

摘要

The present application relates to an ionic resin encapsulation adhesive film and a preparation method, a laminated structure, and a photovoltaic module. The ionic resin encapsulation adhesive film comprises an ionized functional layer, and the ionized functional layer comprises an ionic resin; the ionic resin comprises 50-99% of an ethylene-vinyl acetate copolymer or elastomer, 0.01-40% of an unsaturated metal carboxylate salt, and 0.01-5% of an initiator, based on the total mass content of 100 parts. The unsaturated metal carboxylate salt and the ethylene-vinyl acetate copolymer or elastomer in the adhesive film of the present application have good compatibility, and during use of the adhesive film, the initiator initiates a free radical reaction, so as to form a network structure in the ethylene-vinyl acetate copolymer or elastomer, thereby producing high volume resistivity, improving the anti-PID performance of modules, and maintaining the good light transmittance of the adhesive film.
机译:本申请涉及一种离子树脂封装粘合膜及其制备方法、层压结构和光伏组件。所述离子树脂封装胶膜包括电离功能层,所述电离功能层包括离子树脂;基于100份的总质量含量,离子树脂包含50-99%的乙烯-醋酸乙烯酯共聚物或弹性体、0.01-40%的不饱和金属羧酸盐和0.01-5%的引发剂。本申请粘合剂膜中的不饱和金属羧酸盐和乙烯-醋酸乙烯酯共聚物或弹性体具有良好的相容性,并且在使用粘合剂膜期间,引发剂引发自由基反应,从而在乙烯-醋酸乙烯酯共聚物或弹性体中形成网络结构,从而产生高体积电阻率,提高组件的抗PID性能,并保持胶膜良好的透光性。

著录项

  • 公开/公告号WO2022053051A1

    专利类型

  • 公开/公告日2022-03-17

    原文格式PDF

  • 申请/专利权人 SHANGHAI HIUV NEW MATERIALS CO. LTD.;

    申请/专利号WO2021CN118073

  • 发明设计人 LI MIN;

    申请日2021-09-13

  • 分类号C09J7/10;C09J123/08;H01L31/048;

  • 国家 CN

  • 入库时间 2022-08-25 00:00:24

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