首页> 外国专利> Rosin-based base resin for lead-free solder flux, lead-free solder flux, lead-free solder paste

Rosin-based base resin for lead-free solder flux, lead-free solder flux, lead-free solder paste

机译:无铅焊剂用松香基树脂,无铅焊剂,无铅焊膏

摘要

PROBLEM TO BE SOLVED: To provide a rosin-based base resin for a lead-free solder flux in which cracking of a flux residue and generation of voids are suppressed and the solder paste exhibits excellent storage stability; a lead-free solder flux containing the rosin-based base resin; Providing a lead-free solder paste containing the flux. SOLUTION: This is a rosin-based base resin for lead-free solder flux containing a rosin ester (A) of rosins and a monovalent alcohol, and tetrahydroabietic acid ester (A1) and dihydroabietic acid are contained in the component (A). A rosin-based base resin for lead-free solder flux containing a total of 95% by weight or more of an ester (A2) and a dehydroabietic acid ester (A3). [Selection diagram] None
机译:需要解决的问题:提供一种用于无铅焊剂的松香基基础树脂,其中焊剂残留物的开裂和空隙的产生被抑制,并且焊膏表现出优异的存储稳定性;一种无铅焊剂,其含有所述松香基树脂;提供含有助焊剂的无铅锡膏。解决方案:这是一种用于无铅焊剂的松香基基础树脂,含有松香酯(a)和一价醇,组分(a)中含有四氢枞酸酯(A1)和二氢枞酸。一种用于无铅焊剂的松香基基础树脂,其含有总重量为95%或以上的酯(A2)和脱氢枞酸酯(A3)。[选择图]无

著录项

  • 公开/公告号JP2022037999A

    专利类型

  • 公开/公告日2022-03-10

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20200142258

  • 发明设计人 久保 夏希;柏原 徹也;

    申请日2020-08-26

  • 分类号B23K35/363;B23K35/26;C22C13;

  • 国家 JP

  • 入库时间 2022-08-24 23:58:50

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号