APPARATUS FOR REDUCING MOISTURE OF FRONT OPENING UNIFIED POD IN LOAD PORT MODULE AND SEMICONDUCTOR PROCESS DEVICE COMPRISING THE SAME

摘要

The present invention relates to a device for reducing humidity of a wafer container of a load port module, which is installed on the front surface of a wafer container in a load port module, and forms a gas film at an entrance through which a wafer enters and exits to reduce humidity of the wafer container, and a semiconductor processing apparatus having the same It includes a main body installed on the upper front surface of the wafer container, a blower for blowing gas to supply gas to the inside of the main body, and a dispersion unit for dispersing the gas supplied to the inside of the main body downward to form a gas film. characterized in that Therefore, the present invention provides a gas film at the entrance and exit of the wafer container by installing a main body, a blower and a dispersing part on the front surface of the wafer container in the load port module, thereby forming a barrier gas film at the entrance to reduce the humidity of the wafer container and introducing outside air It provides the effect of blocking