APPARATUS FOR REDUCING MOISTURE OF FRONT OPENING UNIFIED POD IN LOAD PORT MODULE AND SEMICONDUCTOR PROCESS DEVICE COMPRISING THE SAME

摘要

The present invention relates to a device for reducing humidity of a wafer container of a load port module and a semiconductor processing device having the same, which is installed on the front of the wafer container in the load port module to form an air film at the entrance to the wafer container to reduce the humidity of the wafer container. It includes a main body installed on the upper front side of the wafer container, a blowing unit that blows air to supply air to the inside of the main unit, and a dispersing unit that disperses the air supplied to the inside of the main unit downward to form an air film. Characterized in that. Therefore, the present invention forms an air film at the entrance of the wafer container by installing the body part, the blower part, and the dispersion part on the front of the wafer container in the load port module, thereby forming a blocking air film at the entrance to reduce the humidity of the wafer container to inflow outside air. It provides an effect that can block.