首页> 外国专利> Epoxy resin system, use of epoxy resin system, aging resistant epoxy resin molding material and component with epoxy resin molding material

Epoxy resin system, use of epoxy resin system, aging resistant epoxy resin molding material and component with epoxy resin molding material

机译:环氧树脂体系,使用环氧树脂体系,耐老化环氧树脂成型材料和环氧树脂成型材料的组分

摘要

Epoxy resin system, comprehensive-an A component comprising a first epoxy compound and a second epoxy compound;wherein the first epoxy compound comprises an aromatic compound having at least two epoxy functions,wherein the second epoxy compound from a group is chosen, the hydrogenated bisphenol A digylcidyl ethers, hydrogenated bisphenol A digylcidyl ethers, hydrogenated bisphenol F digylcidyl ethers, hydrogenated bisphenol F digylcidyl ethers, hydrogenated substituted bisphenol A digylcidyl ethers, hydrogenated substituted bisphenol A digylcidyl ether oligomers, hydrogenated substituted bisphenol F digylcidyl ether, hydrogenated substituted bisphenol F digylcidyl ether oligomers or a combination thereof,where the A component contains 50–90 Gew-% of the first epoxy compound,where the A component contains 10–45 Gew-% of the second epoxy compound; and-a B component comprising a carboxylic anhydride.
机译:环氧树脂体系,综合 - 一种组分,其包含第一环氧化合物和第二环氧化合物;其中第一环氧化合物包含具有至少两个环氧官能的芳族化合物,其中选择来自组的第二环氧化合物,氢化双酚 碳酸氢乙烯基醚,氢化双酚F型型甲基乙基乙基醚,氢化的双酚F型拓甲酰基醚,氢化取代的双酚A型拓扑基乙基醚,氢化取代的双酚氢化萘甲醚低聚物,氢化取代的双酚F型甲酰甲基醚,氢化取代的双酚F型甲酰甲基乙基醚 低聚物或其组合,其中组分含有第一种环氧化合物的50-90%,其中A组分含有10-45%的第二环氧化合物; 和-B组分包含羧酸酐。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号