FLEXIBLE CIRCUIT BOARD FOR CHIP ON FILM AND CHIP PAKAGE COMPRISING THE SAME, AND ELECTRONIC DEVICE COMPRISING THE SAME

摘要

A flexible circuit board for a chip-on-film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface, and including a chip mounting area; a circuit pattern layer disposed on the first surface; a heat dissipation unit disposed in the chip mounting area, wherein the substrate has at least two holes formed in an area corresponding to the heat dissipation unit, and the heat dissipation unit includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.