DOUGH-LIKE PLAY COMPOUNDS, KITS, AND METHODS OF MAKING AND USING THE SAME

摘要

The present disclosure relates generally to compositions which form a dough-like moldable play compound when combined with a solvent, as well as kits, and methods of making and using the same. More particularly, it relates to compositions, kits, and methods of making and using a powder composition which forms a dough-like moldable play compound with a solvent. In a preferred embodiment, the solvent comprises water.