The invention provides a novel heat-curable molding material containing a matrix resin that has been partially-cured by the action of a polyisocyanate, and a reinforcing fiber. The heat-curable molding material of one embodiment of the present invention contains a matrix resin containing a reaction product (I) of an epoxy compound (A1) represented by general formula (a1) shown below and a polyisocyanate (D), and a reinforcing fiber.
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